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Shenzhen Rong Jiexin Electronic Technology Co. Ltd.

Address: Baoan District City, Xixiang Shenzhen 60

Contact person: Mr. Zhou

Mobile phone: 13825253955

Phone: 0755-29708225

Fax: 0755-29702200

Email: rjx_china@163.com

Web site: www.rjxelec.com

 
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How to choose PCB material
Electronic products, like the use of FR4 epoxy glass fiber substrate, for the use of high temperature or flexible circuit board using polyimide glass fiber board, for high frequency circuit is required to use teflon glass fiber substrate; for the heat dissipation requirements of high electronic products should be used in metal substrate. The factors that should be considered when selecting PCB materials: (1) should be appropriate to choose the glass transition temperature (Tg) of the substrate, Tg should be higher than the circuit operating temperature. (2) the demand for thermal expansion coefficient (CTE) is low. Due to the thermal expansion coefficient of the X, Y and the thickness direction is not consistent, it is easy to cause the deformation of the PCB, which will cause the metal hole fracture and damage element. (3) high heat resistance. General requirements for PCB to have 250 / 50S of heat resistance. (4) the requirements of a good flatness. PCB <0.0075mm warping requirements SMT / mm. (5) electrical performance, high frequency circuit, high dielectric constant, dielectric loss of small materials. Insulation resistance, voltage resistance, resistance to arc performance are to meet the requirements of the product. /upload/file/20150921/20150921141523582358.ppt
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Copyright: Shenzhen Rong Jiexin Electronic Technology Co. Ltd. Address: Baoan District City, Xixiang Shenzhen 60 粤ICP备17082007号
hone: 13825253955         Fax: 0755-29702200